Vitck Technologies

As a collaborative innovation partner in the global electronics industry, Vitck Electronics provides reliable and scalable solutions for the industry

PROVEN TRACK RECORD

Why Global Customer Trust Us

Our commitment to excellence is reflected in measurable outcomes that drive customer success.
On-Time Delivery Rate
99 .5%
Traceability
100 %
Average Engineering Response
48 hr
Defect Rate
< 0 .1%

Our products

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IMS substrate

High‑performance thermally conductive substrates for automotive power electronics, industrial power supplies, and high‑power LEDs. Offering far superior thermal conductivity over traditional FR‑4 boards, excellent heat spreading, and rugged mechanical reliability. Ideal for EV BMS, OBC, and DC‑DC converters.

Advanced Liquid Cooling

Next‑generation cooling solutions for AI data centers and high‑power automotive modules. Supports direct‑to‑chip and two‑phase liquid cooling, capable of handling 1000kW+ AI rack heat loads. Unleash the full potential of next‑gen computing.

 

DBC substrate

Ceramic‑based substrates with copper directly bonded to Al₂O₃ or AlN, delivering excellent thermal conductivity (up to 170–230 W/m·K for AlN), high electrical insulation (>10 kV/mm), and a CTE closely matched to silicon. Ideal for IGBT/SiC power modules, automotive electronics, and high‑power LED/laser applications.

Industries We Serve!

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Major Appliances

IMS/DBC substrates are widely used in inverter air conditioners, induction heating, refrigerator compressor drives, and high-power LED lighting, delivering efficient thermal conduction and reliable insulation to boost energy efficiency and product lifespan.

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Automotive Industry

IMS and DBC substrates serve as the core thermal and structural foundation for EV BMS, OBC, DC-DC converters, and IGBT/SiC power modules. Paired with liquid cooling, they ensure stable operation under harsh conditions.

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AI

Advanced Liquid Cooling provides direct-to-chip and two-phase cooling solutions for AI accelerators, GPU servers, and data centers, supporting 100kW+ high-density rack heat loads and unleashing peak computing performance.

Frequently Asked Questions

Quick answers to technical questions about our capabilities, quality systems, and manufacturing processes.

Yes, we hold current IATF 16949:2016 certification with audited and approved status for automotive production. Our quality management system encompasses product design and development, manufacturing, testing, and supply chain management. We implement APQP (Advanced Product Quality Planning), PPAP (Production Part Approval Process), FMEA (Failure Mode and Effects Analysis), MSA (Measurement System Analysis), and SPC (Statistical Process Control) as standard practice across all manufacturing operations.

We specialize in three core substrate technologies: (1) IMS (Insulated Metal Substrates) with line width/spacing capabilities below 100 µm and thermal conductivity ranging 2-18 W/m·K; (2) DPC (Direct Plated Copper) on Alumina (Al₂O₃) and Aluminum Nitride (AlN) ceramics with thermal conductivity exceeding 30 W/m·K for AlN, featuring selective Ni/Pd/Au plating finishes; and (3) Closed-type power boxes manufactured with low-stress alloys and vacuum brazing technology. Each solution is engineered to meet specific automotive application requirements including automotive LED lighting, power modules, DC-DC converters, high-power IGBT modules, SiC power devices, and EV battery management systems.

Our quality performance is measured against automotive industry benchmarks: defect rate consistently below 500 PPM, on-time delivery rate of 99.5%, and process capability (Cpk) of 1.33 or greater for all critical parameters. We maintain 100% automated optical inspection (AOI) and comprehensive in-process quality controls throughout the manufacturing process. All measurements are validated using calibrated testing equipment with documented measurement system analysis (MSA) certification.

We conduct comprehensive reliability testing covering all critical performance domains: salt spray testing for corrosion resistance validation, thermal shock testing (TST) for temperature cycle durability assessment, helium leak detection for hermeticity verification, strength testing for mechanical integrity confirmation, and vibration testing for dynamic condition durability. All tests are performed to automotive industry standards and documented with full traceability. Testing results are provided as part of our PPAP (Production Part Approval Process) documentation package.

Yes, we provide comprehensive engineering support for custom substrate design, material selection, and manufacturing process optimization. Our technical team collaborates with customers from initial design phase through prototyping, design validation, and volume production ramp. We offer technical consultation on thermal management solutions, circuit layout optimization, plating finish selection (Ni/Pd/Au, selective plating options), and manufacturing process capability analysis to meet specific application requirements and performance targets.

Lead times vary based on product complexity and order volume. For standard IMS and DPC substrates with established design specifications, typical lead time is 2-4 weeks after design approval and release to manufacturing. For custom power box assemblies requiring design optimization and prototype validation, lead time is typically 4-6 weeks. We offer expedited options for urgent requirements upon request. Please contact our sales and engineering team to discuss your specific project timeline and requirements.

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