Wafer Level Direct Cooling
Product Introduction
We specialize in heterostructure crystal bonding technology, tightly fusing different crystalline materials through interfacial atomic diffusion to unlock composite functionalities unattainable in single crystals. As a core technology partner in advanced packaging and heterointegration, we help you push beyond the boundaries of thermal management, sensing, and packaging—co‑creating innovative solutions that deliver both high performance and unwavering reliability.
Product Advantages
For All Your Complicated Needs
Atomic-level Bonding Interface
Seamless atomic contact via interfacial diffusion bonding for minimal resistance.
8-inch Wafer Bonding
- Adhesive-free interfacial diffusion optimized for high uniformity across full 8-inch substrate.
- This technology is suitable for other cystal type and dimensions. Max. 8inch.
High-strength Crystalline Integration
Atomic‑scale lattice fusion via interfacial diffusion bonding, enabling both superior strength and multifunctional integration.
Low-temperature process
low‑temperature (< 300 °C) bonding preserves material properties and broadens material choices.